Document Number: 45157
For technical questions, contact: mlcc@vishay.com
www.vishay.com
Revision: 15-Jun-10
5
VJ 6040
VJ 6040 UHF Chip Antenna for Mobile Devices
Vishay Vitramon
Fig. 8 - Soldering Reflow with Sn Solder
Fig. 9 - Soldering IR Reflow with SnAgCu Solder
t (s)
0
50
100
150
200
250
300
T
(癈)
260 癈
50
100
150
200
250
245 癈
215 癈
180 癈
130 癈
40 s
10 s
10 s
2 K/s
?/DIV>
?/DIV>
0
50
100
150
200
250
300
T
(癈)
Time
60 s to 120 s
30 s to 60 s
Max. temperature
Min. temperature
Sn-Ag-Cu solder paste
60 s to 120 s
60 s to 120 s
ORDERING INFORMATION
VISHAY MATERIAL
PACKAGING QUANTITY
VJ 6040
VJ6040M011SXISRA0
1000 pieces
发布紧急采购，3分钟左右您将得到回复。
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